PCB Blind & Buried Vias
Due to the increasing complexity of design structures blind vias and buried vias are increasingly used in high-density circuit boards (HDI).
A blind Via connects exactly one outer layer with one or more inner layers.
A buried via is a via between at least two inner layers, which is not visible from the outer layers. This technology allows more functionality in less board space (packing density).
For cost reasons, we recommend avoiding an overlap of blind and buried vias in the layer build-up! For example, avoid blind vias from L1 - L3 and simultaneously buried vias from L2 - L4.
Blind vias are used to connect one outer layer with at least one inner layer.
Your advantage: Whether laser or mechanically drilled, we always use the best / cheapest technology suitable for the job!
You can also place your blind vias within pads (via-in-pad).
See also Via-in Pad (Via Filling).
* Note: Most economical are via-in-pad solutions with Ø ≥ 200 microns!